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Samfur Description
The HJ30J Series Micro Rectangular High-Speed Connectors are designed for high-density, high-speed board-to-board interconnections in chassis and cabinet-level applications, offering excellent electrical performance and mechanical reliability in harsh environments.
key Features
- Flexible stranded pin contacts for enhanced reliability
- High-density contact layout with 1.27 mm × 1.27 mm pitch
- Metal shielding shell for superior EMI protection
- Available in 7 shell sizes: 12, 18, 24, 30, 36, 55, 100 contacts
- Ideal for high-speed signal transmission between boards
Technical dalla
| siga | Ƙayyadaddun bayanai |
| Operating zazzabi | -55 ° C to + 125 ° C |
| Halayen impedance | 100 ± 15 Ω |
| Rated halin yanzu | 3 A |
| Sadarwar lamba | ≤ 20mΩ |
| Dielectric jure irin ƙarfin lantarki | 800 V (zafin ɗaki) |
| Hawaye juriya | ≥ 5000 MΩ (500 VDC); ≥ 100 MΩ (wet heat) |
| Data transmission rate | Har zuwa 1.65 Gbps |
| Rayuwa na injina | 500 mating cycles |
| vibration | 10–2000 Hz, 196 m/s² |
| Shock | 735 m / s² |
